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100F Dual Frequency Conversion Ultrafine Gold Wire Drawing Machine

100F Dual Frequency Conversion Ultrafine Gold Wire Drawing Machine

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  • Model 100F
  • No. of Wires 1
  • Inlet Wire Diameter 0.055-0.120 mm
  • Outlet Wire Diameter 0.022-0.040 mm
  • Line Speed (Max.) 1800 m/min
  • No. of Dies (Max.) 24
  • Motor Power 3 KW
  • Take-up Power 1.1 KW
  • Conductor Type Gold, silver, platinum, etc.
  • Drive System Dual frequency converter
  • 100F Dual Frequency Conversion Ultrafine Gold Wire Drawing Machine

    100F dual frequency conversion ultra-fine gold wire drawing machine is a precision equipment specifically designed for producing high-precision gold wires with a diameter of 20-40 microns (0.02-0.04 mm), widely used in semiconductor packaging, precision electronics, medical equipment, high-end jewelry and other fields. Due to the extremely small diameter of the gold wire, the equipment needs to have core technologies such as ultra-high precision tension control, nanoscale molds, and clean environments.

    100F Dual Frequency Conversion Ultrafine Gold Wire Drawing Machine Datasheet

    Item/Model 100F
    Inlet Wire Dia. 0.055-0.120 mm
    Outlet Wire Dia. 0.022-0.040 mm
    Line Speed (Max.) 1800 m/min
    No. of Dies (Max.) 24
    Reduction Rate 8%, final: 7%
    Drawing Method Tower wheels: 2 sets, Fixed speed wheels: 2 sets, spray sliding type.
    Tower Wheel Tower wheels: φ100x14 sections, 2 sets; Fixed speed wheels: φ100, 2 sets; Spray ceramic tower wheel.
    Main Motor 3 KW
    Take-up Motor 1.1 KW
    Traverse Motor 0.4 KW
    Pump Motor 120 W
    Lighting 220V, 40W
    Brake 24V, 30W
    Speed Control Potentiometer
    Traverse Method Ball screw transmission
    Lubrication Downward spray tower transportation, automatic spraying (with water tank, water pump and pay off rack).
    Overall Size 1825x1055x1660 mm
    Total Weight 1.1 T

    100F Dual Frequency Conversion Ultrafine Gold Wire Drawing Machine Application

    100F dual frequency conversion ultra-fine gold wire drawing machine is the core equipment for high-precision manufacturing, with its technical core consisting of nanoscale molds, constant tension control, and clean environment. With the development of semiconductor miniaturization and precision medical devices, this equipment will play a more critical role in high-end electronics, biomedicine, aerospace and other fields, and continue to evolve towards finer, smarter and more environmentally friendly directions.
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